LiPOLY’s G series have EMI shielding effect, they can be bent and are suitable for thin and high-performance mobile devices, especially the XY axis has excellent thermal conductivity. The heat transfer method is through uniform temperature to assists heat element for heat diffusion.
Due to Internet of Things raise, electrical products has tendency to lighter, also with high power, high-speed, and high density. Because of the high power module pursued lighter, high density, high power, and the design of the chip and component pursued high capability, high baud, high efficiency, cause the waste heat and hotspot temperature rise quickly, which become the problem in desperate need to solve.
